RIE-10NR

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Reactive Ion Etching System
RIE-10NR is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry. A computerized touch panel provides user-friendly interface for parameter control and recipe storage.
Etching is performed with minimum sidewall deterioration and a high selectivity between materials. With its sleek, compact design, the RIE-10NR system requires minimal clean room space.

Dimensions:

Main Unit: 500(W) x 920(D) x 1510(H) mm

Pump Unit: 522(W) x 163(D) x 216(H) mm

Highly selective anisotropic etching
Fully automatic "one-button" operation with full manual override
Easy-to-use computerized touch panel for parameter control, recipe entry and storage
Process wafers up to ø8" in diameter
Sleek, compact design uses minimal clean room space

Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride
Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO₂, Poly-Si, Si₃N₄, GaAs and Mo
Manufacturing of micromachines
Failure analysis