Utilized in compound semiconductor and silicon device fabrication, Plasma Enhanced Chemical Vapor Deposition (PECVD) systems are designed for the deposition of insulation and passivation films.
PECVD systems can deposit high-quality silicon-based thin films (SiO2, Si3N4, SiOxNy, a-Si:H).

samco-ucp's LS-CVD (Liquid Source CVD) systems achieve superior step-coverage and gap-fill performance, required for the MEMS, 3D-LSI, and Opto Electronics markets. Importantly, the technology enables deposition at lower temperatures and doesn't require toxic or flammable gases. LS-CVD systems can deposit high-quality TEOS-SiO2, LS-SiN, High-k think film, and Diamond-like-carbon (DLC).